A kind of multi-disciplinary simulation and design platform for IC chamber based on commercial solver
| dc.contributor.author | Xiaojing, Wu | |
| dc.contributor.author | Jia, Cheng | |
| dc.contributor.author | Linhong, Ji | |
| dc.contributor.author | Yuemin, Hou | |
| dc.contributor.author | Yijia, Lu | |
| dc.contributor.editor | Plödereder, E. | |
| dc.contributor.editor | Grunske, L. | |
| dc.contributor.editor | Schneider, E. | |
| dc.contributor.editor | Ull, D. | |
| dc.date.accessioned | 2017-07-26T10:59:28Z | |
| dc.date.available | 2017-07-26T10:59:28Z | |
| dc.date.issued | 2014 | |
| dc.description.abstract | In this paper, a kind of multi-disciplinary simulation and design platform for wafer manufacturing process with Chamber system is presented. This platform is developed as an in-house program, with different functional component for multi-disciplinary problems, which can drive the commercial FEM solver with code. There are also management function for user, products, and analysis or optimization process templates. This platform can be used for analyzing the multidisciplinary process inside chamber system, DOE and optimization analysis for wafer manufacturing process, product and analyzing process template management. | en |
| dc.identifier.isbn | 978-3-88579-626-8 | |
| dc.identifier.pissn | 1617-5468 | |
| dc.language.iso | en | |
| dc.publisher | Gesellschaft für Informatik e.V. | |
| dc.relation.ispartof | Informatik 2014 | |
| dc.relation.ispartofseries | Lecture Notes in Informatics (LNI) - Proceedings, Volume P-232 | |
| dc.title | A kind of multi-disciplinary simulation and design platform for IC chamber based on commercial solver | en |
| dc.type | Text/Conference Paper | |
| gi.citation.endPage | 2054 | |
| gi.citation.publisherPlace | Bonn | |
| gi.citation.startPage | 2049 | |
| gi.conference.date | 22.-26. September 2014 | |
| gi.conference.location | Stuttgart |
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