Bergmann, Neil W.Williams, John A.Han, JieChen, YiKarl, WolfgangBecker, JürgenGroßpietsch, Karl-ErwinHochberger, ChristianMaehle, Erik2019-10-302019-10-3020063-88579-175-7https://dl.gi.de/handle/20.500.12116/29416enA process model for hardware modules in reconfigurable system-on-chipText/Conference Paper1617-5468