A kind of multi-disciplinary simulation and design platform for IC chamber based on commercial solver

Zusammenfassung
In this paper, a kind of multi-disciplinary simulation and design platform for wafer manufacturing process with Chamber system is presented. This platform is developed as an in-house program, with different functional component for multi-disciplinary problems, which can drive the commercial FEM solver with code. There are also management function for user, products, and analysis or optimization process templates. This platform can be used for analyzing the multidisciplinary process inside chamber system, DOE and optimization analysis for wafer manufacturing process, product and analyzing process template management.
  • Vollständige Referenz
  • BibTeX
Xiaojing, W., Jia, C., Linhong, J., Yuemin, H. & Yijia, L., (2014). A kind of multi-disciplinary simulation and design platform for IC chamber based on commercial solver. In: Plödereder, E., Grunske, L., Schneider, E. & Ull, D. (Hrsg.), Informatik 2014. Bonn: Gesellschaft für Informatik e.V.. (S. 2049-2054).
@inproceedings{mci/Xiaojing2014,
author = {Xiaojing, Wu AND Jia, Cheng AND Linhong, Ji AND Yuemin, Hou AND Yijia, Lu},
title = {A kind of multi-disciplinary simulation and design platform for IC chamber based on commercial solver},
booktitle = {Informatik 2014},
year = {2014},
editor = {Plödereder, E. AND Grunske, L. AND Schneider, E. AND Ull, D.} ,
pages = { 2049-2054 },
publisher = {Gesellschaft für Informatik e.V.},
address = {Bonn}
}
DateienGrößeFormatAnzeige
2049.pdf219.2Kb PDF Öffnen

Haben Sie fehlerhafte Angaben entdeckt? Sagen Sie uns Bescheid: Feedback abschicken

Mehr Information

ISBN: 978-3-88579-626-8
ISSN: 1617-5468
Datum: 2014
Sprache: en (en)
Typ: Text/Conference Paper
Sammlungen

Zur Langanzeige